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INESC MN is applying its know-how in microfabrication targeting the industrialization of processes for integrated optical circuits in collaboration with Picadvanced
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INESC MN is applying its know-how in microfabrication targeting the industrialization of processes for integrated optical circuits in collaboration with Picadvanced.
Today we were reducing the thickness of a 3" wafer from 388 microns to 250 microns using Etch KOH.
Find out what this partner is developing by clicking here.
