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Horizon Europe 2027 – Advanced Integrated Photonic Devices for Extended Features and Ultra-Low Power Consumption (RIA)

Within the Horizon Europe Work Programme 2027, the call HORIZON-CL4-2027-05-DIGITAL-EMERGING-03 – Advanced integrated photonic devices for extended features and ultra-low power consumption (RIA) supports research and innovation (RIA) activities aimed at the development of advanced integrated photonic devices and circuits with extended functionality, superior performance, and ultra-low power consumption.

This action seeks to strengthen the competitiveness of European photonics actors by promoting the validation of innovative solutions in representative system configurations and demonstrating their applicability in real-world environments, with cross-sector impact in areas such as digital, automotive, industrial, health, and security.

Main objectives

  • Develop integrated photonic devices and circuits with enhanced functionality and performance;

  • Enable wider adoption of photonics across digital, industrial, and high-performance systems;

  • Significantly improve the performance of electro-optic systems in applications such as communications, computing, sensing, medical diagnostics, data processing, and AI-enabling technologies;

  • Promote low-power sensors with improved performance across multiple application domains.

Technological scope

R&I activities should enhance the functionality, efficiency, and integration of photonic devices and circuits, consider system-level impact, and address at least two of the following aspects:

  • Enhanced performance through improved spectral purity, wavelength coverage, output power, and noise characteristics;

  • Increased modulation or detection speeds, going beyond the capabilities of existing PIC material platforms, improved signal-processing capabilities, and integration of novel materials such as thin-film LiNbO₃, BTO, graphene, silicon carbide, phase-change materials, and TMDCs;

  • Miniaturised, high-complexity photonic circuits (e.g. multilayer photonics, chiplets, multiple integrated functional elements), scalable interconnects, and electronics–photonics integration (co-packaged, heterogeneous, or monolithic) to improve performance, reliability, and cost efficiency;

  • Reduction of power consumption, for example through improved electrical-to-optical conversion, lower optical losses, devices operable at higher temperatures to reduce cooling needs, and low-power circuit actuation and control.

Proposals should demonstrate advancements in representative system configurations relevant to one or more application domains, ensuring a clear link between technological development and system-level impact.

Target audience

  • Technology and industrial companies (SMEs and large enterprises);

  • Manufacturers and suppliers of photonic and microelectronics technologies;

  • R&D centres, universities, and science and technology organisations;

  • European consortia with expertise in integrated photonics, advanced materials, and electronics–photonics integration.

Key information

  • Opening date: 17 November 2026

  • Submission deadline: 18 March 2027

  • Indicative budget: €25 million

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